Versico's EPDM x-23 Low-VOC Bonding Adhesive is a high strength, solvent-based contact adhesive that bonds EPDM membranes to various porous and non-porous substrates. EPDM x-23 Low-VOC Bonding Adhesive is compatible with VersiCore MP-H® and SecurShield® polyisocyanurate insulation, structural and lightweight insulating concrete, APA non-fire treated plywood, oriented strand board, wood fiberboard, SECUROCK®, DensDeck® Prime, masonry, and various metal finishes. EPDM x-23 Low-VOC Bonding Adhesive is easily applied with a medium nap roller, creating a strong adhesive bond between the membrane and substrate.